ROBOTPHOENIX
To create excellent quality with highly-sophisticated technology and to provide professional and highly efficient service.
Amid the dual trends of global semiconductor industry recovery and technological transformation, the world-renowned annual gathering integrating global chip strengths has grandly opened. Centered on the theme Global Integration, Interconnected Chip Innovation, SEMICON CHINA 2026 was held at Shanghai New International Expo Centre from March 25 to 27, 2026.
This exhibition serves as a vital platform for global semiconductor technology exchange, domestic industrial independent substitution and coordinated supply chain development, bringing all-round development opportunities to the whole sector. As an emerging player in semiconductor equipment, Robotphoenix presented its core products at the event, driving industrial upgrading and facilitating high-quality industrial development with the strength of Chinese intelligent manufacturing.
Robotphoenix's booth stood out as a major highlight throughout the exhibition, drawing steady streams of visitors and reflecting its high reputation and profound influence within the semiconductor industry. The company’s horizontal multi-joint 2-Link robot attracted crowds of attendees, who actively consulted the on-site technical team and showed keen interest in the product.
Visitors engaging in in-depth communication spanned semiconductor manufacturing, packaging & testing, equipment R&D and other fields, including senior industry experts, enterprise purchasers and cutting-edge technology researchers. Participants exchanged views with Robotphoenix’s team on product performance, application scenarios and technical advantages, exploring extensive cooperation opportunities. Numerous international guests also visited the booth to learn about core technologies and matching solutions, proving that Robotphoenix’s technical strength and brand influence have gained global recognition.
Enables large-range wafer handling without external auxiliary axes
Supports parallel wafer loading and unloading for up to 4 LoadPorts, delivering higher operating speed while maintaining superior repeat positioning accuracy
Compact structure with ultra-small footprint, saving space for placing chemicals and other production materials near processing equipment
Achieves simultaneous picking and placing of two wafers, compatible with 10mm wafer spacing
Adopts multiple wafer handling methods including vacuum suction and mechanical clamping
At this exhibition, Robotphoenix’s wafer handling robot passed stringent full-process tests by TÜV Rheinland and was officially awarded the SEMI S2 Certificate. This authoritative certification consolidates the brand’s leading international position in the semiconductor field, enabling it to provide high-standard and highly reliable wafer handling solutions for semiconductor manufacturers worldwide.
2026 marks a critical period for the recovery of the global semiconductor industry, as domestic substitution in China accelerates steadily. SEMICON CHINA undertakes the important mission of boosting industrial upgrading and deepening global cooperation.
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